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We combine image correlation and thermography to measure the two-dimensional strain field along with the temperature distribution of a specimen in a tensile testing machine. Both methods have been combined before, yet they usually rely on different imaging devices, requiring the strain and temperature data to be aligned and parallax-corrected in post-processing. In our novel approach, we perform the image correlation directly on the thermography data – thus reducing the complexity of the measurement setup significantly. We demonstrate the method by quantifying the stress-strain-temperature relation of localized deformation bands in aluminum.
Fabian Göttfert,Holger Sparr,Matthias Ziegenhorn,Gunnar Dammass, andMatthias Krauß
"Combining thermography and stress analysis for tensile testing in a single sensor", Proc. SPIE 12109, Thermosense: Thermal Infrared Applications XLIV, 121090A (27 May 2022); https://doi.org/10.1117/12.2618947
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Fabian Göttfert, Holger Sparr, Matthias Ziegenhorn, Gunnar Dammass, Matthias Krauß, "Combining thermography and stress analysis for tensile testing in a single sensor," Proc. SPIE 12109, Thermosense: Thermal Infrared Applications XLIV, 121090A (27 May 2022); https://doi.org/10.1117/12.2618947