Presentation + Paper
25 May 2022 Optimization study of all-dielectric metamaterial cladding for increased integration density of PIC
Andraž Debevc, Marko Topič, Janez Krč
Author Affiliations +
Abstract
Evanescent coupling between optical waveguides (WGs) in photonic integrated circuits (PICs) is the origin of unwanted optical cross-talk between adjacent WG structures. Employing an all-dielectric metamaterial cladding, consisting of two periodically exchanging dielectric materials, can potentially reduce the cross-talk between WGs, and thus, paves the way towards higher integration density. In this contribution we present the results of numerical simulations in the process of optimization of all-dielectric metamaterial cladding of silicon strip WGs to achieve the lowest possible gap width between WG cores that still satisfies the chosen reference cross-talk level (-30 dB at the distance of 2 mm). We also investigate how the performance of WGs with metamaterial cladding is affected, if the metamaterial cladding is present only in the spacing between WGs. We show that the gap width can be in best case decreased by 60 % representing a 45 % improvement in integration density for the case of 450 nm core width. We also investigate the wavelength dependence of effects and determine the usable wavelength range of optimized structures. Furthermore, we extend the study to account for fabrication variability of the sub-wavelength structures. A general trend is observed that structures with the lowest achieved gap width exhibit the narrowest wavelength range and the highest sensitivity to fabrication variability. However, we still demonstrate a sizable decrease in gap width of 37 % and a relatively wide usable wavelength range of > 75 nm when accounting for a feature size variation in the range of ± 5 nm.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andraž Debevc, Marko Topič, and Janez Krč "Optimization study of all-dielectric metamaterial cladding for increased integration density of PIC", Proc. SPIE 12148, Integrated Photonics Platforms II, 121480B (25 May 2022); https://doi.org/10.1117/12.2624433
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KEYWORDS
Metamaterials

Cladding

Waveguides

Silicon

Photonic integrated circuits

Refractive index

Dielectrics

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