Paper
4 May 2022 A new high-voltage diode structure with backside double injection holes (BDIH)
Lihao Wang, Xintian Zhou, Feng Liu, Lei Zhang
Author Affiliations +
Proceedings Volume 12172, International Conference on Electronic Information Engineering and Computer Communication (EIECC 2021); 1217228 (2022) https://doi.org/10.1117/12.2634686
Event: International Conference on Electronic Information Engineering and Computer Communication (EIECC 2021), 2021, Nanchang, China
Abstract
A 3.3-kV silicon power diode with backside double injection holes is presented in this paper, which has been studied according to TCAD simulations. By setting the backside p-regions on the cathode side of the active area and setting the inside n+ layer in the backside p-regions, that is, the combination of P+N-P+N+ structure, P+N-P+ structure and P+N-N+ structure is set from the anode to the cathode. This new diode structure combines the advantages of the RFC diode and the CIBH diode, which could greatly improve the over-current turn-off ruggedness and soft reverse recovery characteristics at low current densities.
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lihao Wang, Xintian Zhou, Feng Liu, and Lei Zhang "A new high-voltage diode structure with backside double injection holes (BDIH)", Proc. SPIE 12172, International Conference on Electronic Information Engineering and Computer Communication (EIECC 2021), 1217228 (4 May 2022); https://doi.org/10.1117/12.2634686
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KEYWORDS
Diodes

Doping

Plasma

Electrons

Ionization

Silicon

Electronics

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