Design of multi-layer tri-band antenna based on half-mode
technology

Xu Han; Yiming Tang

doi:10.1117/12.2634845

4 May 2022 Design of multi-layer tri-band antenna based on half-mode technology

Xu Han, Yiming Tang

Proceedings Volume 12172, International Conference on Electronic Information Engineering and Computer Communication (EIECC 2021); 121722C (2022) https://doi.org/10.1117/12.2634845
Event: International Conference on Electronic Information Engineering and Computer Communication (EIECC 2021), 2021, Nanchang, China

Abstract

In this paper, a multilayer tri-band microstrip antenna for the packaging system is designed based on half-mode technology. The antenna can work at 2.4 GHz, 3.5 GHz and 5.8 GHz at the same time, which can be applied to Wi-Fi and WiMAX frequency bands. The antenna uses three layers of rectangular metal patches stacked vertically as the radiation unit to ensure that the antenna will not interfere with each other in three frequency bands. The simulation results of the relative bandwidth of the three frequency bands are 0.083% (2.39 ~ 2.41 GHz), 2.29% (3.44 ~ 3.52 GHz) and 4.14% (5.69 ~ 5.93 GHz) respectively. The gain of the antenna is 1.77 dbi at 2.4 GHz, 3.49 dbi at 3.5 GHz and 5.4 dbi at 5.8 GHz which have good radiation characteristics. This antenna is advantageous because the structure is small and it has the independent tunable ability compared to other tri-band antennas.

Citation Download Citation

Xu Han and Yiming Tang "Design of multi-layer tri-band antenna based on half-mode technology", Proc. SPIE 12172, International Conference on Electronic Information Engineering and Computer Communication (EIECC 2021), 121722C (4 May 2022); https://doi.org/10.1117/12.2634845

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KEYWORDS

Antennas

Dielectrics

Telecommunications

Wireless communications

Packaging

Metals

Microwave radiation

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