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17 March 2023 Advances in high-power/high-brightness diode lasers operating at 445nm for material processing applications (Conference Presentation)
Christopher Halle, Bien Chann, Francisco Villarreal, Bryan Lochman, Wang Zhou, Matthew Sauter, Abraham Wong, Futoshi Tsutsumi, Takaoshi Okamoto
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Proceedings Volume 12403, High-Power Diode Laser Technology XXI; 124030P (2023) https://doi.org/10.1117/12.2650542
Event: SPIE LASE, 2023, San Francisco, California, United States
Abstract
Industrial high-power/high-brightness blue diode lasers are quickly becoming a preferred laser source for processing highly reflective materials such as copper, stainless steel, and Aluminum.This paper focuses on the recent advances applying Wavelength Beam Combining (WBC) technology to diode bars emitting in the 445nm region. We will present results from latest developments in power scaling introducing an 800W Blue laser coupled with fiber diameters ≤50um while providing a beam parameter product of < 2.2 mm*mrad. Next, we will share applications results using these blue lasers at various power levels in a variety of processes including micro welding and engraving, conduction mode welding, keyhole welding and cutting of thin metal sheets.Finally, we will discuss the future of this technology regarding power scaling beyond 800W and combining our blue laser sources with multi-kilowatt high brightness diode lasers operating in the 975nm region to achieve improved applications results.
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Christopher Halle, Bien Chann, Francisco Villarreal, Bryan Lochman, Wang Zhou, Matthew Sauter, Abraham Wong, Futoshi Tsutsumi, and Takaoshi Okamoto "Advances in high-power/high-brightness diode lasers operating at 445nm for material processing applications (Conference Presentation)", Proc. SPIE 12403, High-Power Diode Laser Technology XXI, 124030P (17 March 2023); https://doi.org/10.1117/12.2650542
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KEYWORDS
Semiconductor lasers
Materials processing
Copper
Fiber coupled lasers
Fiber lasers
Laser cutting
Laser sources
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