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As the semiconductor process technology steps into a more advanced node, design and process induced systematic defects become increasingly significant yield limiters. Focus Exposure Matrix (FEM) method is crucial for early detection of these defects. However, analysis of a typical FEM wafer which contains half million of defects requires extensive time and efforts. In order to improve FEM wafers review efficiency, we introduce a smart review point selection strategy based on different layout pattern grouping modes. This review point selection strategy enable engineers to sample the more effective defects for SEM review.
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Yuan Gan, Changlian Yan, Rongjia Zhang, Ming Ding, Chunying Han, Junhai Jiang, Zongchang Yu, "Improving FEM wafer review efficiency by introducing different pattern grouping modes," Proc. SPIE 12495, DTCO and Computational Patterning II, 124951L (28 April 2023); https://doi.org/10.1117/12.2656632