Detection of bonding voids for 3D integration

Cong Chen; Dieter Van Den Heuvel; Matteo Beggiato; Bensu Tunca Altintas; Alain Moussa; Anne Vandooren; Bart Baudemprez; Michael Schöbitz; Wassim Khaldi; Janusz Bogdanowicz; Christophe Beral; Anne-Laure Charley

doi:10.1117/12.2657950

27 April 2023 Detection of bonding voids for 3D integration

Cong Chen, Dieter Van Den Heuvel, Matteo Beggiato, Bensu Tunca Altintas, Alain Moussa, Anne Vandooren, Bart Baudemprez, Michael Schöbitz, Wassim Khaldi, Janusz Bogdanowicz, Christophe Beral, Anne-Laure Charley

Author Affiliations +

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124961B (2023) https://doi.org/10.1117/12.2657950
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

Wafer bonding is a key technology for many advanced chip technologies. For 3D integration, advanced stacking schemes and high-density packaging put a stringent requirement on the bonding reliability. Bonding quality can be characterized by the absence of voids at the bonding interface, as the voids delimit the complexity of the subsequent processing and integration steps. Therefore, in-line and non-destructive inspection techniques for void detection are crucial for early-stage detection and full process integration. In this work, we perform a comprehensive study on bonding void detection for 3D integration. We fabricate bonded Si wafers with programmed bonding voids with size from 10 nm to 20 μm. We combine different inspection and review tools, including acoustic, optical, electron beam etc., for bonding void detection at different process steps of the fabrication with different top Si thicknesses.

Conference Presentation

Citation Download Citation

Cong Chen, Dieter Van Den Heuvel, Matteo Beggiato, Bensu Tunca Altintas, Alain Moussa, Anne Vandooren, Bart Baudemprez, Michael Schöbitz, Wassim Khaldi, Janusz Bogdanowicz, Christophe Beral, and Anne-Laure Charley "Detection of bonding voids for 3D integration", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124961B (27 April 2023); https://doi.org/10.1117/12.2657950

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available