Low temperature thermal strain of the IRFPA and the creep lifetime evaluation of solder joints

YueBo Liu; JiaHui Yan; WenYuan Liao; Hao Niu; XiYu Chen; ShuWang Li; CanXiong Lai; ShaoHua Yang

doi:10.1117/12.2651868

23 January 2023 Low temperature thermal strain of the IRFPA and the creep lifetime evaluation of solder joints

YueBo Liu, JiaHui Yan, WenYuan Liao, Hao Niu, XiYu Chen, ShuWang Li, CanXiong Lai, ShaoHua Yang

Proceedings Volume 12556, AOPC 2022: Optoelectronics and Nanophotonics; 1255616 (2023) https://doi.org/10.1117/12.2651868
Event: Applied Optics and Photonics China 2022 (AOPC2022), 2022, Beijing, China

Abstract

Cryogenic Infrared Rays Focal Plane Array (IRFPA) detectors have been widely used in industry, transportation, security monitoring, meteorology and medicine because of the high sensitivity and temperature resolution. For HgCdTe IRFPA detectors, the typical working temperature is about 80 K. To make the IRFPA detector works at low temperatures, the detector should be integrated on a Dewar cold platform, whose refrigeration power would be higher than the heat load of the IRFPA. In general, the IRFPA detector and the Dewar cold platform would be integrated together to form a Dewar assembly at room temperature. In addition, the materials in IRFPA have different thermal expand coefficients, it means the thermal mismatch in the IRFPA would be an unavoidable issue in work. The thermal strain has a significant effect on the solder joints in switching cycle, which could lead to the creep strain and thermal fatigue crack. With the increase of the switch cyclic number, the creep strain and thermal fatigue crack under the thermal stress would lead to the failure of solder joints. Therefore, the low temperature thermal strain in switching cycle can affect the reliability of IRFPA detectors. So, the low temperature thermal strain and the creep lifetime of solder joints has been researched.

Citation Download Citation

YueBo Liu, JiaHui Yan, WenYuan Liao, Hao Niu, XiYu Chen, ShuWang Li, CanXiong Lai, and ShaoHua Yang "Low temperature thermal strain of the IRFPA and the creep lifetime evaluation of solder joints", Proc. SPIE 12556, AOPC 2022: Optoelectronics and Nanophotonics, 1255616 (23 January 2023); https://doi.org/10.1117/12.2651868

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available