Paper
16 June 2023 Modal analysis of binding device and multi-target optimization design
Yan Wang, Gui-jun Gao, Ke Zhang, Zhen Duan, Wen-hao Cheng
Author Affiliations +
Proceedings Volume 12639, Third International Conference on Mechanical Design and Simulation (MDS 2023); 126390E (2023) https://doi.org/10.1117/12.2681865
Event: Third International Conference on Mechanical Design and Simulation (MDS 2023), 2023, Xi'an, China
Abstract
Aiming at the cracking of support frame caused by vibration of automatic binding device, the vibration characteristics of the device were studied by means of vibration test and modal analysis, and the structure of the device was optimized. Firstly, modal simulation analysis was used to solve the first six-order natural frequencies and the corresponding mode shapes of the device. On this basis, vibration test was completed. By analyzing the acceleration spectrum of four measuring points of the device, the relationship between vibration characteristics and natural frequencies was studied. Finally, choose multi-target optimization method to optimize the device frame structure.The results show that the vibration amplitudes of the measuring points from high to low are as follows: the upper left frame of the device, the beam of the motor, the upper part of the middle frame and the middle of the middle frame. By comparing the mode shapes with the vibration tests, it is found that the mode that has a great influence on the vibration of the device occurs in the second-order, which is manifested as bending vibration, and the device resonates at 9.02Hz. The first and second-order frequencies after the optimization of the bundle device are 5.60Hz and 12.58Hz. Compared with the optimization before,the frequencies increase -10.4% and +39.5%, it has greatly improved the safe operating range of the bundle device.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yan Wang, Gui-jun Gao, Ke Zhang, Zhen Duan, and Wen-hao Cheng "Modal analysis of binding device and multi-target optimization design", Proc. SPIE 12639, Third International Conference on Mechanical Design and Simulation (MDS 2023), 126390E (16 June 2023); https://doi.org/10.1117/12.2681865
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KEYWORDS
Vibration

Modal analysis

Design and modelling

Analytical research

Instrument modeling

Mathematical optimization

3D modeling

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