Chip leveling and focusing with laser interferometry

Yoshitada Oshida; Minoru Tanaka; Tetsuzou Tanimoto; Toshiei Kurosaki

doi:10.1117/12.20192

1 June 1990 Chip leveling and focusing with laser interferometry

Yoshitada Oshida, Minoru Tanaka, Tetsuzou Tanimoto, Toshiei Kurosaki

Proceedings Volume 1264, Optical/Laser Microlithography III; (1990) https://doi.org/10.1117/12.20192
Event: Microlithography '90, 1990, San Jose, CA, United States

Abstract

A new chip leveling and focusing method has been developed which uses interferometry with a laser beam which has S-polarization and a large incident angle to the exposure surface of an LSI wafer and thereby leveling and focusing accuracy is maintained regardless of the kinds of layers on the wafer. A pilot model of this type of detection method demonstrated a leveling and focusing accuracy of about and 1.

Citation Download Citation

Yoshitada Oshida, Minoru Tanaka, Tetsuzou Tanimoto, and Toshiei Kurosaki "Chip leveling and focusing with laser interferometry", Proc. SPIE 1264, Optical/Laser Microlithography III, (1 June 1990); https://doi.org/10.1117/12.20192

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