Paper
1 August 1990 Processing of ceramics by excimer lasers
Isamu Miyamoto, Hiroshi Maruo
Author Affiliations +
Proceedings Volume 1279, Laser-Assisted Processing II; (1990) https://doi.org/10.1117/12.20622
Event: The International Congress on Optical Science and Engineering, 1990, The Hague, Netherlands
Abstract
Processing of S13N4 arid Zr02 ceramics was rerformed by using ArF , KrF and XeF excimer lasers with mainly mask projection, and characteristics of ceramic processing and surface appearance were analyzed. Focused excimer laser beam from unstable resonator was also used for cutting, and compared with focused c02 and YAG lasers of nonnal pulse. Material removal process of excimer lasers was compared with O2 and YAG lasers of normal pulse on the basis of energy analysis, X-ray diffraction and spectral analysis during ablation of Si3N4 . It was found that in material processing by 002 and YAG lasers, Si3N4 is decomposed into N and liquid Si, which attaches to the surface, producing roughened surface with cracks . On the other hand, in excimer laser processing, Si3N4 is decomposed into Si. (g) and N with accompanying ionized Si by its high peak power , resulting in excellent quality of processing without deposition of decomposed materials . The mechanism of uneven laser processing in Si3N4 and Zr02 ceramics was also discussed.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Isamu Miyamoto and Hiroshi Maruo "Processing of ceramics by excimer lasers", Proc. SPIE 1279, Laser-Assisted Processing II, (1 August 1990); https://doi.org/10.1117/12.20622
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Cited by 17 scholarly publications.
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KEYWORDS
Excimer lasers

Ceramics

Laser processing

Silicon

YAG lasers

Laser cutting

Laser drilling

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