Paper
1 April 2024 Modeling and thermal simulation of alumina ceramic encapsulated copper-coated substrate
Xingyu Yao, Xiaosong Ma
Author Affiliations +
Proceedings Volume 13082, Fourth International Conference on Mechanical Engineering, Intelligent Manufacturing, and Automation Technology (MEMAT 2023); 130821C (2024) https://doi.org/10.1117/12.3026244
Event: 2023 4th International Conference on Mechanical Engineering, Intelligent Manufacturing and Automation Technology (MEMAT 2023), 2023, Guilin, China
Abstract
Multilayer ceramic substrate is mostly used in electronic packaging substrate because of its high strength, good insulation, excellent thermal conductivity and heat resistance, small thermal expansion coefficient and stable chemical properties. In this paper, solid works is used for 3D modeling, including bare chip, three-layer ceramic substrate, substrate through hole, copper-covered wiring. At the same time, ANSYS workbench software was used for finite element analysis and thermodynamic coupling simulation method was adopted, that is, temperature field data was imported into the structure field. The results showed that the deformation and stress were not large and the thermodynamic performance of the structure was stable under the cyclic test at -65°C-150°C standard temperature.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Xingyu Yao and Xiaosong Ma "Modeling and thermal simulation of alumina ceramic encapsulated copper-coated substrate", Proc. SPIE 13082, Fourth International Conference on Mechanical Engineering, Intelligent Manufacturing, and Automation Technology (MEMAT 2023), 130821C (1 April 2024); https://doi.org/10.1117/12.3026244
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KEYWORDS
Ceramics

Copper

Thermal deformation

Design

Modeling

Reliability

Temperature metrology

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