Visual inspection machine for solder joints using tiered illumination

Yuji Takagi; Seiji Hata; Susumu Hibi; Wilhelm Beutel

doi:10.1117/12.25375

1 March 1991 Visual inspection machine for solder joints using tiered illumination

Yuji Takagi, Seiji Hata, Susumu Hibi, Wilhelm Beutel

Proceedings Volume 1386, Machine Vision Systems Integration in Industry; (1991) https://doi.org/10.1117/12.25375
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

We have developed a visual inspection machine for solder int defects of SMDS (Surface Mount Devices) mounted on PCBs (Printed Circuit Boards). The change of the intensity of the reflected light obtained by illuminating the soldered surface from different incident angles depends on the gradient of the soldered surface. We generate an images that represents this change of intensity and analyze this image to inspect the solder joint defects. In addition we report on an automatic generation program of the NC data for inspection.

Citation Download Citation

Yuji Takagi, Seiji Hata, Susumu Hibi, and Wilhelm Beutel "Visual inspection machine for solder joints using tiered illumination", Proc. SPIE 1386, Machine Vision Systems Integration in Industry, (1 March 1991); https://doi.org/10.1117/12.25375

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