Paper
1 December 1991 Review of measurement systems for evaluating thermal expansion homogeneity of Corning Code 7971 ULE®
Henry E. Hagy
Author Affiliations +
Abstract
Early on in the development of glass Code 7971 ULETM, Corning recognized that applications demanded thermal expansion measurements with higher precision and accuracy than that available. Hence a program was launched starting with 10cm path laser Fizeau interferometry to establish an absolute base. Differential methods followed with large sandwich seals and a high precision vitreous silica superdilatometer. Destructive in nature, these tests led to a nondestructive ultrasonic procedure that permits absolute and differential measurements with an uncertainty of +/- 2 ppb/ degree(s)C and reliably performed at the manufacturing plant. Details of these measurement systems are described along with optional experimental variations. A principle, established with seal testing, is reviewed showing that expansion differentials in ULETM are independent of temperature. Finally, recent plant measurements of both axial and radial thermal expansion variations in ULETM boules are presented.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Henry E. Hagy "Review of measurement systems for evaluating thermal expansion homogeneity of Corning Code 7971 ULE®", Proc. SPIE 1533, Optomechanics and Dimensional Stability, (1 December 1991); https://doi.org/10.1117/12.48856
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Glasses

Ultrasonics

Optomechanical design

Silica

Vitreous

Error analysis

Calibration

RELATED CONTENT

Cylindrical surface measurement
Proceedings of SPIE (November 08 2018)
Measurement and analysis of compaction in fused silica
Proceedings of SPIE (April 07 1999)
Self-calibrating multichannel laser interferometer
Proceedings of SPIE (June 01 1998)
Measuring the stability of three copper alloys
Proceedings of SPIE (November 01 1990)

Back to Top