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While miniatuarization of semiconductors has enabled aluminum wiring pattern dimensions smaller and smaller, this has also given rise to problems such as stress migration and electromigration. The use of copper reportedly suppreses such migration.
Fukashi Harada,T. Kondo,J. Konno,Shuzo Fujimura,K. Shinagawa, andT. Takada
"Protection of aluminum alloy films from after corrosion using H2O down stream ashing", Proc. SPIE 1593, Dry Etch Technology, (1 February 1992); https://doi.org/10.1117/12.56930
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Fukashi Harada, T. Kondo, J. Konno, Shuzo Fujimura, K. Shinagawa, T. Takada, "Protection of aluminum alloy films from after corrosion using H2O down stream ashing," Proc. SPIE 1593, Dry Etch Technology, (1 February 1992); https://doi.org/10.1117/12.56930