Direct measurement of stepper mark detection accuracy on processed wafers

Paolo Canestrari; Samuele Carrera; Giovanni Rivera

doi:10.1117/12.59804

1 June 1992 Direct measurement of stepper mark detection accuracy on processed wafers

Paolo Canestrari, Samuele Carrera, Giovanni Rivera

Proceedings Volume 1673, Integrated Circuit Metrology, Inspection, and Process Control VI; (1992) https://doi.org/10.1117/12.59804
Event: Microlithography '92, 1992, San Jose, CA, United States

Abstract

A novel method to evaluate the accuracy of the stepper alignment system on processed substrates has been developed. The technique allows one to measure directly, with a limited number of wafers and high accuracy, just the contribution of the alignment system inaccuracy to final overlay. Applications of the method are under evaluation, especially in the optimization of the alignment systems of steppers. Experimental procedures and algorithms are provided and some examples of experimental results are shown.

Citation Download Citation

Paolo Canestrari, Samuele Carrera, and Giovanni Rivera "Direct measurement of stepper mark detection accuracy on processed wafers", Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); https://doi.org/10.1117/12.59804

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available