Signal processor packaging design

Paul L. McCarley; Mickie Ann Phipps

doi:10.1117/12.161436

20 October 1993 Signal processor packaging design

Paul L. McCarley, Mickie Ann Phipps

Proceedings Volume 1957, Architecture, Hardware, and Forward-Looking Infrared Issues in Automatic Target Recognition; (1993) https://doi.org/10.1117/12.161436
Event: Optical Engineering and Photonics in Aerospace Sensing, 1993, Orlando, FL, United States

Abstract

The Signal Processor Packaging Design (SPPD) program was a technology development effort to demonstrate that a miniaturized, high throughput programmable processor could be fabricated to meet the stringent environment imposed by high speed kinetic energy guided interceptor and missile applications. This successful program culminated with the delivery of two very small processors, each about the size of a large pin grid array package. Rockwell International's Tactical Systems Division in Anaheim, California developed one of the processors, and the other was developed by Texas Instruments' (TI) Defense Systems and Electronics Group (DSEG) of Dallas, Texas. The SPPD program was sponsored by the Guided Interceptor Technology Branch of the Air Force Wright Laboratory's Armament Directorate (WL/MNSI) at Eglin AFB, Florida and funded by SDIO's Interceptor Technology Directorate (SDIO/TNC). These prototype processors were subjected to rigorous tests of their image processing capabilities, and both successfully demonstrated the ability to process 128 X 128 infrared images at a frame rate of over 100 Hz.

Citation Download Citation

Paul L. McCarley and Mickie Ann Phipps "Signal processor packaging design", Proc. SPIE 1957, Architecture, Hardware, and Forward-Looking Infrared Issues in Automatic Target Recognition, (20 October 1993); https://doi.org/10.1117/12.161436

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