Essential aspects of metrological protection of laser technology

Jan Owsik

doi:10.1117/12.203311

1 March 1995 Essential aspects of metrological protection of laser technology

Jan Owsik

Proceedings Volume 2202, Laser Technology IV: Research Trends, Instrumentation, and Applications in Metrology and Materials Processing; (1995) https://doi.org/10.1117/12.203311
Event: Laser Technology: Fourth Symposium, 1993, Szczecin, Poland

Abstract

On 3 April 1993 the Seym of the Republic of Poland passed the following acts: (1) The law on measures; (2) The law on creation of a Head Office of Measures; and (3) Polish Standard PN- 91/T-06700 Safety at radiation emitted by laser devices. Equipment qualification. Demands and directions for the user. These acts impose a necessity of metrological checking of measuring instruments used in laser technology and are of importance for life safety, health, and environment protection. Metrological checking is a test, statement and certification that the measuring instrument fulfills conditions settled in rules, standards, international recommendations and other adequate documents and its indications have been related to national standards of measure units and are consistent with them within the limits of specified measurement errors. Increasing requirements for precise dosage of laser radiation stimulates a necessity of developing a measurement base of high accuracy and requires production of devices enabling metrological checking of laser radiation measurement instruments. Special attention is paid to automation of measuring systems. In fact, the basis of metrological protection of laser technology does not exist in Poland, that is why basic tasks are presented in the paper. These problems should create an elementary basis of metrological protection of laser technology in the future.

Citation Download Citation

Jan Owsik "Essential aspects of metrological protection of laser technology", Proc. SPIE 2202, Laser Technology IV: Research Trends, Instrumentation, and Applications in Metrology and Materials Processing, (1 March 1995); https://doi.org/10.1117/12.203311

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