Improved aluminum plug process for submicron via filling

Hong Yang; Yih-Shung Lin; Loc Nguyen; De-Dui Liao; J. Worley; Greg Smith; Fu-Tai Liou

doi:10.1117/12.186052

9 September 1994 Improved aluminum plug process for submicron via filling

Hong Yang, Yih-Shung Lin, Loc Nguyen, De-Dui Liao, J. Worley, Greg Smith, Fu-Tai Liou

Proceedings Volume 2335, Microelectronics Technology and Process Integration; (1994) https://doi.org/10.1117/12.186052
Event: Microelectronic Manufacturing, 1994, Austin, TX, United States

Abstract

Aluminum plug process for submicron via filling can be improved by using conventional sputtering machine and multi-step deposition process. It is found that the first-step aluminum deposition greatly impacts via step coverage. The effect of this first step metal thickness is more dramatic at higher deposition temperature. Our experiments show that it is necessary to have a continuous Al film in the vias to fully cover the sidewall and bottom at the early stage of the deposition, so that the bulk material can flow in during deposition to fill the vias. The improved process has been successfully implemented in volume production of 0.6 micrometers ASIC and 0.6 micrometers SRAM technologies.

Citation Download Citation

Hong Yang, Yih-Shung Lin, Loc Nguyen, De-Dui Liao, J. Worley, Greg Smith, and Fu-Tai Liou "Improved aluminum plug process for submicron via filling", Proc. SPIE 2335, Microelectronics Technology and Process Integration, (9 September 1994); https://doi.org/10.1117/12.186052

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