Plastic-molded package of AlGaInP laser apparatus

Hsing Chen; Rong-Yih Hwang; Jung-Tsung Hsu; Biing-Jye Lee

doi:10.1117/12.237690

10 April 1996 Plastic-molded package of AlGaInP laser apparatus

Hsing Chen, Rong-Yih Hwang, Jung-Tsung Hsu, Biing-Jye Lee

Proceedings Volume 2683, Fabrication, Testing, and Reliability of Semiconductor Lasers; (1996) https://doi.org/10.1117/12.237690
Event: Photonics West '96, 1996, San Jose, CA, United States

Abstract

A new apparatus is proposed for the package of AlGaInP visible laser diodes (LD) in this paper. Corresponding to the metal-can used in the conventional LD apparatus, plastics and lead-frame are used in this apparatus to reduce its cost. All the chip-mounting and wire- bonding for the apparatus are also modified to accord with the requirement of simplicity and good productivity. An lead-frame with a heat-dissipation tail is specially designed to overcome the poor heat-conductivity problem, which is observed in the common plastic-molded apparatus. The life time of the AlGaInP LD using the new plastic-molded apparatus is about five times longer than that using the common one.

Citation Download Citation

Hsing Chen, Rong-Yih Hwang, Jung-Tsung Hsu, and Biing-Jye Lee "Plastic-molded package of AlGaInP laser apparatus", Proc. SPIE 2683, Fabrication, Testing, and Reliability of Semiconductor Lasers, (10 April 1996); https://doi.org/10.1117/12.237690

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