MCP-based x-ray collimators for lithography of semiconductor devices

Adam N. Brunton; John Ernest Lees; George W. Fraser; Anton S. Tremsin; W. Bruce Feller; Paul L. White

doi:10.1117/12.245096

19 July 1996 MCP-based x-ray collimators for lithography of semiconductor devices

Adam N. Brunton, John Ernest Lees, George W. Fraser, Anton S. Tremsin, W. Bruce Feller, Paul L. White

Proceedings Volume 2805, Multilayer and Grazing Incidence X-Ray/EUV Optics III; (1996) https://doi.org/10.1117/12.245096
Event: SPIE's 1996 International Symposium on Optical Science, Engineering, and Instrumentation, 1996, Denver, CO, United States

Abstract

Soft x-ray optics based on slumped, profiled microchannel plates (MCPs) are under development. Their purpose is to collimate the expanding beam from a laser-plasma x-ray source, resulting in a parallel beam suitable for lithography of semiconductor devices. We present a prototype design for such an optic with a radius of curvature optimized for maximum beam intensity. The plate thickness (and hence the channel length) is varied as a function of distance from the plate center. The resulting plate profile is determined by the radius of curvature but not by the x- ray energy. This design is shown by Monte Carlo ray-trace modeling to give a circular illuminated field with a diameter of 36mm for 1 keV x-rays. The calculated intensity of the beam is equivalent to that of the divergence beam at a distance of 0.35m from the source. We also present preliminary x-ray measurements from the optic. These optics, while designed with the semiconductor industry in mind, may find application in any field where a uniform or parallel soft x-ray or VUV beam is required.

Citation Download Citation

Adam N. Brunton, John Ernest Lees, George W. Fraser, Anton S. Tremsin, W. Bruce Feller, and Paul L. White "MCP-based x-ray collimators for lithography of semiconductor devices", Proc. SPIE 2805, Multilayer and Grazing Incidence X-Ray/EUV Optics III, (19 July 1996); https://doi.org/10.1117/12.245096

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