Paper
20 March 1997 Microdeformation evolution properties of copper bicrystals by digital speckle correlation metrology
Xiaoping Wu, Hengwen Yu, Xide Li, Xiaofang Hu
Author Affiliations +
Proceedings Volume 2921, International Conference on Experimental Mechanics: Advances and Applications; (1997) https://doi.org/10.1117/12.269789
Event: International Conference on Experimental Mechanics: Advances and Applications, 1996, Singapore, Singapore
Abstract
In this paper, the evolution properties of micro-deformation field in the copper bicrystals with a symmetric tilt boundary are studied with Digital Speckle Metrology. The micro-speckles are successfully made and the SEM speckle photographs under different loading stages are obtained. The deformation field of the copper bicrystals is quantitatively studied for the first time, and the micro-displacement field and strain field are accurately calculated. The experimental results show that, the evolution characteristics of the displacement field is obviously different from that of the macro-displacement field. These results provide some basic experimental data for the study of micromechanics.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiaoping Wu, Hengwen Yu, Xide Li, and Xiaofang Hu "Microdeformation evolution properties of copper bicrystals by digital speckle correlation metrology", Proc. SPIE 2921, International Conference on Experimental Mechanics: Advances and Applications, (20 March 1997); https://doi.org/10.1117/12.269789
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KEYWORDS
Speckle

Copper

Scanning electron microscopy

Metrology

Photography

Microscopy

Software

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