Moire interferometry/termovision method for electronic package testing

Leszek A. Salbut; Malgorzata Kujawinska

doi:10.1117/12.281157

17 September 1997 Moire interferometry/termovision method for electronic package testing

Proceedings Volume 3098, Optical Inspection and Micromeasurements II; (1997) https://doi.org/10.1117/12.281157
Event: Lasers and Optics in Manufacturing III, 1997, Munich, Germany

Abstract

The method combining moire interferometry and termovision techniques (MI/T) for thermally loaded elements testing is proposed. The methodology of the MI/T method applied for simultaneous in-plane displacement/strain and temperature distributions monitoring and measurement at electronic elements is described. The results of thermal tests performed at electronic chip UCY74S405N are presented.

Citation Download Citation

Leszek A. Salbut and Malgorzata Kujawinska "Moire interferometry/termovision method for electronic package testing", Proc. SPIE 3098, Optical Inspection and Micromeasurements II, (17 September 1997); https://doi.org/10.1117/12.281157

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