3D visual inspection of IC bonding wires

Sim Heng Ong; X. Q. Han; Q. Z. Ye

doi:10.1117/12.284030

18 August 1997 3D visual inspection of IC bonding wires

Sim Heng Ong, X. Q. Han, Q. Z. Ye

Proceedings Volume 3185, Automatic Inspection and Novel Instrumentation; (1997) https://doi.org/10.1117/12.284030
Event: ISMA '97 International Symposium on Microelectronics and Assembly, 1997, Singapore, Singapore

Abstract

During the stage of pre-cap inspection, 3D profiles of bonded wires are inspected to detect defects such as lifted, tight and sagging wires, and to measure the maximum wire height. This paper presents a novel inspection system based on the application of the stereo technique. In our single- camera setup, stereo views are obtained by rotating the IC chip under the camera. Wire bond edges are detected using Canny's method. These are then linked to form curves, and matching is conducted between two curve lists of a stereo pair. Results of local matching are combined to find the global optimum. The depth measurement of our system has an accuracy of 14 micrometers , which corresponds to one-fortieth of the total range of wire height.

Citation Download Citation

Sim Heng Ong, X. Q. Han, and Q. Z. Ye "3D visual inspection of IC bonding wires", Proc. SPIE 3185, Automatic Inspection and Novel Instrumentation, (18 August 1997); https://doi.org/10.1117/12.284030

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