High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging

Yung-Sheng Liu; R. J. Wojnarowski; W. B. Hennessy; P. A. Piacente; John R. Rowlette Sr.; Michael A. Kadar-Kallen; Jared D. Stack; Yue Liu; Andrzej Peczalski; Ajay Nahata

doi:10.1117/12.307590

5 May 1998 High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging

Yung-Sheng Liu, R. J. Wojnarowski, W. B. Hennessy, P. A. Piacente, John R. Rowlette Sr., Michael A. Kadar-Kallen, Jared D. Stack, Yue Liu, Andrzej Peczalski, Ajay Nahata

Author Affiliations +

Proceedings Volume 3288, Optoelectronic Interconnects V; (1998) https://doi.org/10.1117/12.307590
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

The technical approach and progress achieved under the Polymer Optical Interconnect Technology (POINT) program are described in this paper. The POINT program is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University, and University of California at San Diego (UCSD), sponsored by DARPA/ETO, to develop affordable optoelectronic packaging and interconnect technologies for board and backplane applications. Specifically, progress is reported on (a) development of a plastic VCSEL array packaging technology using batch and planar fabrication, (b) demonstration of high-density optical interconnects for board and backplane applications using polymer waveguides to a length of 50 cm at an I/O density of 250 channels per inch, (c) development of low-loss optical polymer waveguides with loss less than 0.1 dB/cm at 850 nm, and (d) development of passively alignment processes for efficient coupling between a VCSEL array and polymer waveguides. Significant progress has also been made under the POINT program at Columbia University, in applying CAD tools to simulate multi-mode-guided wave systems and, at UCSD, to assist mechanical and thermal design in optoelectronic packaging. Because of space limitations, these results will be described elsewhere in future publications.

Citation Download Citation

Yung-Sheng Liu, R. J. Wojnarowski, W. B. Hennessy, P. A. Piacente, John R. Rowlette Sr., Michael A. Kadar-Kallen, Jared D. Stack, Yue Liu, Andrzej Peczalski, and Ajay Nahata "High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging", Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); https://doi.org/10.1117/12.307590

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
13 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Waveguides

Polymers

Vertical cavity surface emitting lasers

Polymer multimode waveguides

Packaging

Optical alignment

Optical interconnects

Show All Keywords

Keywords/Phrases

Search In:

Publication Years