Electroabsorption modulator packaging for greater than 20-GHz link applications

David H. Boger; David M. Carberry; Elizabeth Twyford Kunkee; Heinrich Muller; Fernando D. Alvarez; Xenophon G. Glavas

doi:10.1117/12.339088

3 February 1999 Electroabsorption modulator packaging for greater than 20-GHz link applications

David H. Boger, David M. Carberry, Elizabeth Twyford Kunkee, Heinrich Muller, Fernando D. Alvarez, Xenophon G. Glavas

Proceedings Volume 3541, Fiber Optic and Laser Sensors and Applications; Including Distributed and Multiplexed Fiber Optic Sensors VII; (1999) https://doi.org/10.1117/12.339088
Event: Photonics East (ISAM, VVDC, IEMB), 1998, Boston, MA, United States

Abstract

Efficient, linear, broadband optical modulators are an essential component in wide bandwidth optical links for high fidelity distribution and processing of wideband signals. We discuss the packaging issues and remedies for the packaging of electroabsorption modulators for greater than 20 GHz link applications. The EAM is a waveguide semiconductor quantum well device which we have demonstrated to have a excellent linearity and electrical to optical conversion efficiency. Several important issues require resolution in order to produce a high bandwidth, packaged product. These include temperature control, EAM back-side metallization, attachment of EAM to submount, Product hermeticity, alignment and attachment of input and output fibers to the device at sub- micron tolerances, retaining this alignment over operational temperatures and anticipated vibration environments, and elimination of outgassing materials that may serve as failure initiators to optical facets. This paper addresses these issues.

Citation Download Citation

David H. Boger, David M. Carberry, Elizabeth Twyford Kunkee, Heinrich Muller, Fernando D. Alvarez, and Xenophon G. Glavas "Electroabsorption modulator packaging for greater than 20-GHz link applications", Proc. SPIE 3541, Fiber Optic and Laser Sensors and Applications; Including Distributed and Multiplexed Fiber Optic Sensors VII, (3 February 1999); https://doi.org/10.1117/12.339088

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