Characterization of on-chip coils for rf microsystems

Marcus Weser; Josef Binder; Sven Rehfuss; Rainer Laur

doi:10.1117/12.341263

10 March 1999 Characterization of on-chip coils for rf microsystems

Marcus Weser, Josef Binder, Sven Rehfuss, Rainer Laur

Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341263
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France

Abstract

For the application of wireless-operated microsystems, on- chip coils are manufactured by 3D UV depth lithography and electroplating. The effects of varying the following parameters were investigated: substrate material, insulation thickness, coil material, coil structure height, coil design and the effect of using an intermediate NiFe layer. The characterization is done with the help of the measured real and imaginary part of the on-chip in a continuous frequency range of 75 kHz to 30 MHz.

Citation Download Citation

Marcus Weser, Josef Binder, Sven Rehfuss, and Rainer Laur "Characterization of on-chip coils for rf microsystems", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); https://doi.org/10.1117/12.341263

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