Fatigue test of thin film materials on a silicon chip using resonating loading system

Taeko Ando; Tetsuo Yoshioka; Mitsuhiro Shikida; Kazuo Sato

doi:10.1117/12.341166

10 March 1999 Fatigue test of thin film materials on a silicon chip using resonating loading system

Taeko Ando, Tetsuo Yoshioka, Mitsuhiro Shikida, Kazuo Sato

Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341166
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France

Abstract

We investigated a new method of measuring fatigue characteristics of thin films under uniaxial loading conditions. A specimen and loading system are integrated on a same silicon ship. The size of the chip is 12 by 12 by 0.4 mm, and of the specimen 400 by 80 by 7 micrometers . Accuracy of the stress and strain measurement using the proposed loading system was proved by our previous work under static conditions. In this paper, high frequency of tensile stress was applied to the specimen by resonant mode of vibration of the loading mechanism. The loading system vibrated at the first mode resonant frequency. To vibrate the loading system, the chip was mounted on a PZT actuator, and driven by a pulse generator. The amplitude of the applied strain was measured by observing a laser reflection on the vibrating lever of the loading system, while the wave from and the vibration cycle were monitoring by an oscilloscope. The resonant frequency of the chip was 4-5 kHz.

Citation Download Citation

Taeko Ando, Tetsuo Yoshioka, Mitsuhiro Shikida, and Kazuo Sato "Fatigue test of thin film materials on a silicon chip using resonating loading system", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); https://doi.org/10.1117/12.341166

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KEYWORDS

Silicon

Silicon films

Actuators

Thin films

Oscilloscopes

Etching

Ferroelectric materials

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