Crack growth monitoring in harsh environments by electrical potential measurements

W. Randolph Lloyd; Walter G. Reuter; David M. Weinberg

doi:10.1117/12.372827

8 December 1999 Crack growth monitoring in harsh environments by electrical potential measurements

W. Randolph Lloyd, Walter G. Reuter, David M. Weinberg

Proceedings Volume 3852, Harsh Environment Sensors II; (1999) https://doi.org/10.1117/12.372827
Event: Photonics East '99, 1999, Boston, MA, United States

Abstract

Electric potential measurement (EPM) technology offers an attractive alternative to conventional nondestructive evaluation for monitoring crack growth in harsh environments. Where conventional NDE methods typically require localized human interaction, the EPM technique developed at Idaho National Engineering and Environmental Laboratory can be operated remotely and automatically. Once a crack-like defect is discovered via conventional means, EPM can be applied to monitor local crack size changes. This is of particular interest in situations where an identified structural defect is not immediately rejectable from a fitness-for-service viewpoint, but due to operational and environmental conditions may grow to an unsafe size with continuing operation. If the location is in a harsh environment where periodic monitoring by normal means is either too costly or not possible, a very expensive repairs may be immediately mandated. However, the proposed EPM methodology may offer a unique monitoring capability that would allow for continuing service.

Citation Download Citation

W. Randolph Lloyd, Walter G. Reuter, and David M. Weinberg "Crack growth monitoring in harsh environments by electrical potential measurements", Proc. SPIE 3852, Harsh Environment Sensors II, (8 December 1999); https://doi.org/10.1117/12.372827

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