Paper
8 September 1999 Deposition of hydrogen-free DLC film over large areas by KrF (248 nm) pulsed-laser ablation with substrate scanning
Tie-jun Li, Jingru Liu, Li-ge Wang, Shuzhen Xie, Shengde He
Author Affiliations +
Proceedings Volume 3862, 1999 International Conference on Industrial Lasers; (1999) https://doi.org/10.1117/12.361203
Event: International Symposium on Industrial Lasers, 1999, Wuhan, China
Abstract
In this work, large area uniform hydrogen-free DLC films have been deposited at room temperature by KrF pulsed laser ablation with the technique-Computer Controlled Substrate Scanning under High Vacuum Condition. Raman analysis of the films gave a broad Raman peak centered at 1545 cm-1. The films exhibited a thickness variation less than +/- 5% within the area of 66 X 70 mm2. Microhardness test showed that the films had a mechanical hardness up to 27 GPa with the variation less than +/- 5% within the same film. Film adhesion strength test indicated that the films deposited on silicon substrate had an excellent adhesion strength up to 2 X 104 r at the rotary speed of 300 rpm. In discussion, scanning speed of the substrate is supposed to be an important factor with the uniformity of the film. As to adhesion strength of DLC films, the energy of the particles deposited on the substrate is supposed to be the most important factor in addition to routine treatment. Getting particles with high energy and small size should be a feasible way to greatly improve the adhesion strength of DLC film with different substrates.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tie-jun Li, Jingru Liu, Li-ge Wang, Shuzhen Xie, and Shengde He "Deposition of hydrogen-free DLC film over large areas by KrF (248 nm) pulsed-laser ablation with substrate scanning", Proc. SPIE 3862, 1999 International Conference on Industrial Lasers, (8 September 1999); https://doi.org/10.1117/12.361203
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KEYWORDS
Pulsed laser deposition

Raman spectroscopy

Particles

Carbon

Excimer lasers

Laser ablation

Silicon films

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