Paper
26 April 2001 Optical proximity strategies for desensitizing lens aberrations
Author Affiliations +
Proceedings Volume 4404, Lithography for Semiconductor Manufacturing II; (2001) https://doi.org/10.1117/12.425214
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom
Abstract
The use of image process integration to minimize the effect of lens aberrations on the micro lithographic imaging process is briefly surveyed. Examples show how field of curvature, focus and spherical aberrations can be minimized by using off-axis illumination and scattering bar OPC. Sub- resolution assist features redistribute the energy within the pitches' diffraction pattern, reducing the weighted average aberration. A demonstration of the use of scattering bars to balance the magnitude of aberrated diffraction orders to correct focus shifts of isolated to semi-isolated features is provided. This example shows the impact of symmetric aberrations on 100 nm images produced using off- axis 248 nm illumination, 0.7 numerical aperture and chrome less phase-shift mask for pitches of 260 nm, 300 nm, 350 nm, 400 nm, 500 nm, 600 nm, 1200 nm and 10000 nm.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John S. Petersen "Optical proximity strategies for desensitizing lens aberrations", Proc. SPIE 4404, Lithography for Semiconductor Manufacturing II, (26 April 2001); https://doi.org/10.1117/12.425214
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CITATIONS
Cited by 3 scholarly publications and 2 patents.
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KEYWORDS
Scattering

Diffraction

Image processing

Photomasks

Imaging systems

Fiber optic illuminators

Phase shifts

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