Simulations-based design for a large-displacement electrostatically actuated microrelay

Gooi Boon Chong; Kam See Hoon; Ijaz H. Jafri; Daniel J. Keating

doi:10.1117/12.425384

5 April 2001 Simulations-based design for a large-displacement electrostatically actuated microrelay

Gooi Boon Chong, Kam See Hoon, Ijaz H. Jafri, Daniel J. Keating

Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001) https://doi.org/10.1117/12.425384
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France

Abstract

An electrostatically actuated microrelay with large displacement, small actuation voltage and limited plate surface dimensions is designed to meet stringent telecommunication switching requirements. Fabrication feasibility and performance characteristics of the device are evaluated using a commercial CAD for MEMS tool. Simulation results of the device performance including pull-in voltages for different suspension stiffness variations, natural frequencies, stresses and restoring forces are presented.

Citation Download Citation

Gooi Boon Chong, Kam See Hoon, Ijaz H. Jafri, and Daniel J. Keating "Simulations-based design for a large-displacement electrostatically actuated microrelay", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); https://doi.org/10.1117/12.425384

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