Automatic Self-Testing Of Machine-To-Machine Matching Of Wafer Steppers

Paul Swanson; Gerald Alonzo; Jim Dey

doi:10.1117/12.941913

29 June 1984 Automatic Self-Testing Of Machine-To-Machine Matching Of Wafer Steppers

Paul Swanson, Gerald Alonzo, Jim Dey

Proceedings Volume 0470, Optical Microlithography III: Technology for the Next Decade; (1984) https://doi.org/10.1117/12.941913
Event: 1984 Microlithography Conferences, 1984, Santa Clara, United States

Abstract

Measuring the overlay registration of wafer steppers is often a tedious, time-consuming task that is subject to inaccuracy and operator subjectivity. Electrical measurements of overlay can be quite accurate, but they require special equipment that is often not found in a wafer fab area, and there can be an undesirable delay before the results of the tests can be obtained. This paper describes a technique that can be used to quickly and automatically measure the overlay registration of multiple steppers on a wafer fab line. By analysis of the test results, it is possible to identify the specific sources of some of the overlay errors. Variations in the stage stepping patterns from one machine to another can be reduced by using the results of the tests to cause the machines to emulate the stepping pattern of a desired standard.

Citation Download Citation

Paul Swanson, Gerald Alonzo, and Jim Dey "Automatic Self-Testing Of Machine-To-Machine Matching Of Wafer Steppers", Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); https://doi.org/10.1117/12.941913

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