Knowledge-based design of optoelectronic packaging and assembly automation

Timothy P Kurzweg; Allon Guez; Shubham K. Bhat

doi:10.1117/12.519164

30 September 2003 Knowledge-based design of optoelectronic packaging and assembly automation

Timothy P Kurzweg, Allon Guez, Shubham K. Bhat

Proceedings Volume 5264, Optomechatronic Systems IV; (2003) https://doi.org/10.1117/12.519164
Event: Photonics Technologies for Robotics, Automation, and Manufacturing, 2003, Providence, RI, United States

Abstract

In this paper, we present an automation technique that yields high performance, low cost optoelectronic alignment and packaging through the use of intelligent control theory and system-level modeling. Our control loop design is based on model predictive control, previously popularized in process and other control industries. Our approach is to build an a priori knowledge model, specific to the assembled package’s optical power propagation characteristics, and use this to set the initial "feed-forward" conditions of the automation system. In addition to this feed-forward model, our controller is designed with feedback components, along with the inclusion of a built in optical power sensor. The optical modeling is performed with the rigorous scalar Rayleigh-Sommerfeld formulation, efficiently solved using an angular spectrum technique. One of the benefits of using our knowledge based control technique is that the efficiency of the automation process can be increased, as the number of alignment steps can be greatly reduced. An additional benefit of our technique is that it can reduce the possibility that attachment between optical components will occur at local power maximums, instead of the global maximum of the power distribution. Therefore, our technique improves system performance, while reducing the overall cost of the automation process.

Citation Download Citation

Timothy P Kurzweg, Allon Guez, and Shubham K. Bhat "Knowledge-based design of optoelectronic packaging and assembly automation", Proc. SPIE 5264, Optomechatronic Systems IV, (30 September 2003); https://doi.org/10.1117/12.519164

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available