Paper
20 August 2004 A photomask defect evaluation system
Eiji Yamanaka, Shingo Kanamitsu, Takashi Hirano, Satoshi Tanaka, Takahiro Ikeda, Osamu Ikenaga, Tsukasa Kawashima, Syogo Narukawa, Hideaki Kobayashi
Author Affiliations +
Abstract
Photomasks are currently inspected based on the standard of defect size. A shortcoming of this standard is that the type of defects which do not impact on a wafer, could be detected as impermissible defects. All of them are subject to repair works and some of them require further inspection by AIMS. This is one of the factors that are pushing down the yield and the turnaround time (TAT) of mask manufacturing. An effective way to improve this situation will be to do the repair works selectively on the defects that are predicted to inflict a functional damage on a wafer. In this report, we will propose a defect evaluation system named ADRES (Advanced Photomask Defect Repair Evaluation System), featuring a function to extract edges from a mask SEM image to be passed on to a litho-simulation. A distinctive point of our system is the use of a mask SEM image with a high resolution.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eiji Yamanaka, Shingo Kanamitsu, Takashi Hirano, Satoshi Tanaka, Takahiro Ikeda, Osamu Ikenaga, Tsukasa Kawashima, Syogo Narukawa, and Hideaki Kobayashi "A photomask defect evaluation system", Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); https://doi.org/10.1117/12.557782
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Photomasks

Scanning electron microscopy

Semiconducting wafers

Manufacturing

Inspection

Image resolution

Lithography

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