Integrating DfM components into a cohesive design-to-silicon solution

Lars Liebmann; Dan Maynard; Kevin McCullen; Nakgeuon Seong; Ed Buturla; Mark Lavin; Jason Hibbeler

doi:10.1117/12.604723

5 May 2005 Integrating DfM components into a cohesive design-to-silicon solution (Invited Paper)

Lars Liebmann, Dan Maynard, Kevin McCullen, Nakgeuon Seong, Ed Buturla, Mark Lavin, Jason Hibbeler

Proceedings Volume 5756, Design and Process Integration for Microelectronic Manufacturing III; (2005) https://doi.org/10.1117/12.604723
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

Two primary tracks of DfM, one originating from physical design characterization, the other from low-k₁ lithography, are described. Examples of specific DfM efforts are given and potentially conflicting layout optimization goals are pointed out. The need for an integrated DfM solution than ties together currently parallel DfM efforts of increasing sophistication and layout impact is identified and a novel DfM-enabling design flow is introduced.

Citation Download Citation

Lars Liebmann, Dan Maynard, Kevin McCullen, Nakgeuon Seong, Ed Buturla, Mark Lavin, and Jason Hibbeler "Integrating DfM components into a cohesive design-to-silicon solution (Invited Paper)", Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); https://doi.org/10.1117/12.604723

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