MAID: manufacturing aware IC design

Louis K. Scheffer

doi:10.1117/12.605371

5 May 2005 MAID: manufacturing aware IC design

Louis K. Scheffer

Proceedings Volume 5756, Design and Process Integration for Microelectronic Manufacturing III; (2005) https://doi.org/10.1117/12.605371
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

Design tools should take manufacturing foibles into account, on this everyone agrees. But specifically, which DFM issues should IC design software take into account, and how should they be conveyed from the fab to the design tools? Here we examine an approach that expresses four of the most pressing DFM concerns - point defect densities, via yield, lithographic process windows, and cell yield - in a way design tools can easily understand. We show these data types can be combined, they can be read quickly, and that they allow designs to be analyzed (and potentially optimized) with speeds commensurate with other existing algorithms that run on large designs. The major concern that remains is getting useful DFM data from the manufacturing firms. Without this, for example, IC design tools cannot trade off one effect against another.

Citation Download Citation

Louis K. Scheffer "MAID: manufacturing aware IC design", Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); https://doi.org/10.1117/12.605371

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available