Paper
29 March 2006 Fundamental parameter extraction for a dry/immersion hybrid photoresist for contact hole applications
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Abstract
EPICTM 2330 photoresist is an imaging material designed for conventional dry and immersion ArF exposure, its formulation is optimized for contact hole features. Although it performs well in both imaging modes, with good profile, it is not known whether the presence of water impacts the materials fundamental imaging characteristics. Acid generation efficiency, characteristic acid diffusion length and dissolution rates are determined for EPIC 2330 under dry and immersion imaging conditions. The results show, that within measurement errors, no difference is observed for these fundamental parameters whether water is present during exposure, or not.
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Stewart A. Robertson, Shintaro Yamada, and Joanne M. Leonard "Fundamental parameter extraction for a dry/immersion hybrid photoresist for contact hole applications", Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 615312 (29 March 2006); https://doi.org/10.1117/12.658030
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KEYWORDS
Diffusion

Photoresist materials

Lithography

Semiconducting wafers

Absorption

Data modeling

Thin film coatings

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