Paper
24 October 2006 Analysis of BGA defects by tomographic images
T. Sumimoto, T. Maruyama, Y. Azuma, S. Goto, M. Mondou, N. Furukawa, S. Okada
Author Affiliations +
Abstract
To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
T. Sumimoto, T. Maruyama, Y. Azuma, S. Goto, M. Mondou, N. Furukawa, and S. Okada "Analysis of BGA defects by tomographic images", Proc. SPIE 6357, Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence, 63571N (24 October 2006); https://doi.org/10.1117/12.716986
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Cited by 5 scholarly publications.
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KEYWORDS
Tomography

X-rays

Inspection

Image analysis

X-ray imaging

Image processing

Bridges

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