High-resolution in-die metrology using beam profile reflectometry and ellipsometry

Chungsam Jun; Jangik Park; Jon Opsal; Heath Pois; In-Kyo Kim; Jung-Wook Kim; Lena Nicolaides

doi:10.1117/12.712516

5 April 2007 High-resolution in-die metrology using beam profile reflectometry and ellipsometry

Chungsam Jun, Jangik Park, Jon Opsal, Heath Pois, In-Kyo Kim, Jung-Wook Kim, Lena Nicolaides

Proceedings Volume 6518, Metrology, Inspection, and Process Control for Microlithography XXI; 65183D (2007) https://doi.org/10.1117/12.712516
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

A new application for ultra-fast and repeatable in-die determination of CD structures at the ~1 &mgr;m length scale using BPR®/BPE® (Beam Profile Reflectometry/Ellipsometry) technologies on an Opti-Probe OP9000 series system, is presented and summarized. Two structures were measured and analyzed, including a poly-silicon CD standard and an advanced poly-silicon recessed structure relevant to advanced memory devices. A focused beam spot (~1 &mgr;m) and "fast BPR" data acquisition capability (~17 ms) were utilized to perform high-resolution scans across wafer and within single die regions. Rotating Compensator Spectroscopic Ellipsometry (RCSE®) signals were also used to independently determine and compare to BPR results from data collected over larger areas (~15 &mgr;m). The BPR/BPE and SE results for line CD were found to have high correlation. Further, model regression for SE data coupled with an artificial neural network model and fast BPR were utilized to measure and calculate 10,000 points across a 1 mm² area in a matter of minutes. Overall, the results were found to be repeatable and correlated well to CD-SEM analysis.

Citation Download Citation

Chungsam Jun, Jangik Park, Jon Opsal, Heath Pois, In-Kyo Kim, Jung-Wook Kim, and Lena Nicolaides "High-resolution in-die metrology using beam profile reflectometry and ellipsometry", Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65183D (5 April 2007); https://doi.org/10.1117/12.712516

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available