Process monitoring and analysis of atmospheric pressure plasma polishing method

Jufan Zhang; Bo Wang; Shen Dong

doi:10.1117/12.782885

14 November 2007 Process monitoring and analysis of atmospheric pressure plasma polishing method

Jufan Zhang, Bo Wang, Shen Dong

Proceedings Volume 6722, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 67220O (2007) https://doi.org/10.1117/12.782885
Event: 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Large Mirrors and Telescopes, 2007, Chengdu, China

Abstract

Atmospheric pressure plasma polishing (APPP) method is a novel non-contact machining technology. It utilizes atmospheric pressure plasma to excite reactive radicals which cause chemical reactions with surface atoms to perform atom-scale removal process. Since the machining process is chemical in nature, APPP method avoids surface/subsurface defects. The removal process is a complicated integrated action which is affected by many factors, such as radio frequency power, gas ratio, temperature, and the like. Hence, it is necessary to monitor and analyze the process from different aspects and by various means. Through the analysis of atomic emission spectroscopy, the impacting rules of the radio frequency power and gas ratio were investigated. The temperature distribution on the workpiece surface was initially established by experiments and the results correspond well with the qualitative analysis conclusion from finite element method. Then, by initial technology optimization, the removal rate of 1.46mm³/min and Ra 0.6nm surface roughness were achieved in subsequent machining operations.

Citation Download Citation

Jufan Zhang, Bo Wang, and Shen Dong "Process monitoring and analysis of atmospheric pressure plasma polishing method", Proc. SPIE 6722, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 67220O (14 November 2007); https://doi.org/10.1117/12.782885

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