Paper
30 October 2007 LRC techniques for improved error detection throughout the process window
Venson Lee, Sheng-Hua Tsai, Jun Zhu, Lantian Wang, Shu-Mei Yang, Dan White
Author Affiliations +
Abstract
Litho rule checking (LRC) is now an established component in the mask synthesis flow. Yet the requirements placed on LRC have grown as process complexity has increased. At 45nm and beyond, new techniques are required to thoroughly and efficiently evaluate a layout for potential lithographic problems. This paper examines new modeling and checking techniques which improve the detection of lithographic errors. For more thorough error detection across a wider range of process points, a process window technique provides checking of potential lithographic errors at nine different process points. To better detect potential pinches or bridges induced by deep sub-wavelength lithography, a technique which identifies problems regardless of orientation is used. These techniques provide more thorough checking, both better accuracy and improved runtime performance across the complete process window.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Venson Lee, Sheng-Hua Tsai, Jun Zhu, Lantian Wang, Shu-Mei Yang, and Dan White "LRC techniques for improved error detection throughout the process window", Proc. SPIE 6730, Photomask Technology 2007, 67303F (30 October 2007); https://doi.org/10.1117/12.746439
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KEYWORDS
Optical proximity correction

Error analysis

Lithography

Model-based design

Data modeling

Photomasks

Process modeling

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