Development of thick negative photoresists for electroplating applications

Chunwei Chen; Robert Plass; Edward Ng; Sam Lee; Stephen Meyer; Georg Pawlowski; Rozalia Beica

doi:10.1117/12.773986

26 March 2008 Development of thick negative photoresists for electroplating applications

Chunwei Chen, Robert Plass, Edward Ng, Sam Lee, Stephen Meyer, Georg Pawlowski, Rozalia Beica

Proceedings Volume 6923, Advances in Resist Materials and Processing Technology XXV; 69233E (2008) https://doi.org/10.1117/12.773986
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

We report about the development of a thick negative photoresist series, AZ^(R) EXP 125nXT, and their use in electroplating levels up to 160 μm thickness. The new photoresist series enables coatings of 5-120 μm with acceptable uniformity and edge bead in a single coat step. 200 μm photoresist coating was achieved by a double coating processes. The lithographic performance of the photoresists was evaluated using broad band aligners and steppers. Optimized lithographic parameters to achieve straight and nearly vertical side wall profiles are reported. The photoresists show not only excellent adhesion to copper with no surface treatment and electroplating tolerance in a variety of metal plating solutions, but is also compatible with silicon and gold substrates. The photoresists have been found to be easily stripped with no residues in solvent based stripper solutions.

Citation Download Citation

Chunwei Chen, Robert Plass, Edward Ng, Sam Lee, Stephen Meyer, Georg Pawlowski, and Rozalia Beica "Development of thick negative photoresists for electroplating applications", Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69233E (26 March 2008); https://doi.org/10.1117/12.773986

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