Scalable (24-140 Gbps) optical data link well adapted for future maskless lithography applications

A. Paraskevopoulos; S.-H. Voss; M. Talmi; G. Walf

doi:10.1117/12.811495

17 March 2009 Scalable (24-140 Gbps) optical data link well adapted for future maskless lithography applications

A. Paraskevopoulos, S.-H. Voss, M. Talmi, G. Walf

Proceedings Volume 7271, Alternative Lithographic Technologies; 72711I (2009) https://doi.org/10.1117/12.811495
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

Maskless lithography based on electron beam parallelization requires well adapted data links, capable of transmitting the corresponding data volume at rates up to the Tbps domain. In this paper we focus on a scalable (24 - 140 Gbps) optical data link, well adapted for future implementation in maskless lithography systems. The link comprises a high-speed data buffer with synchronizable architecture and scalable throughput (N x 24 Gbps), an optical free space transmission solution, a 45 channel low-noise optical receiver chip based on BiCMOS 0.6 micron technology and, finally, a Data Processor & Demux IP core implemented in VHDL.

Citation Download Citation

A. Paraskevopoulos, S.-H. Voss, M. Talmi, and G. Walf "Scalable (24-140 Gbps) optical data link well adapted for future maskless lithography applications", Proc. SPIE 7271, Alternative Lithographic Technologies, 72711I (17 March 2009); https://doi.org/10.1117/12.811495

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