Modular infrared 640 x 480 pixel camera core for rapid device integration

Loïc Le Noc; Bruno Tremblay; François Lagacé; Luc Mercier; François Duchesne; Alain Bergeron; Hubert Jerominek

doi:10.1117/12.818451

7 May 2009 Modular infrared 640 x 480 pixel camera core for rapid device integration

Loïc Le Noc, Bruno Tremblay, François Lagacé, Luc Mercier, François Duchesne, Alain Bergeron, Hubert Jerominek

Proceedings Volume 7298, Infrared Technology and Applications XXXV; 729827 (2009) https://doi.org/10.1117/12.818451
Event: SPIE Defense, Security, and Sensing, 2009, Orlando, Florida, United States

Abstract

In the observation and surveillance fields, there is an increasing demand for infrared modules that can be rapidly turned into a complete autonomous device whether it is for military, security or industrial purposes. Based on this concept, INO has developed a modular 16 bit infrared camera core. The tool can be used to provide a rapid evaluation of an application concept. Moreover, a complete device can be rapidly designed and build once the concept has been demonstrated. The IRXCore-640 camera core, integrating a 640 x 480 pixel uncooled FPA and providing a 16-bit raw signal output at 60 Hz, gives total access to the detector configuration parameters to ease developers integration process. TECless operation minimizes module size and power consumption. The camera core can be configured at the factory for outdoors operation from -30°C to +60°C with 200°C scene dynamic range at maximum sensitivity. The device can be used with refractive optics or catadioptric optical objectives. Windowing capability provides flexibility in frame frequency, sensitivity selection, and a choice of operating field of view. High resolution/high sensitivity can be achieved. In this paper, the camera core will be reviewed as well as its performances. The control software functionalities are detailed and some typical imaging examples will be presented.

Citation Download Citation

Loïc Le Noc, Bruno Tremblay, François Lagacé, Luc Mercier, François Duchesne, Alain Bergeron, and Hubert Jerominek "Modular infrared 640 x 480 pixel camera core for rapid device integration", Proc. SPIE 7298, Infrared Technology and Applications XXXV, 729827 (7 May 2009); https://doi.org/10.1117/12.818451

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