Flexible and reliable high power injection locked laser for double exposure and double patterning ArF immersion lithography

Masaya Yoshino; Hiroshi Umeda; Hiroaki Tsushima; Hidenori Watanabe; Satoshi Tanaka; Shinich Matsumoto; Takashi Onose; Hiroyuki Nogawa; Yasufumi Kawasuji; Takashi Matsunaga; Junichi Fujimoto; Hakaru Mizoguchi

doi:10.1117/12.846337

10 March 2010 Flexible and reliable high power injection locked laser for double exposure and double patterning ArF immersion lithography

Masaya Yoshino, Hiroshi Umeda, Hiroaki Tsushima, Hidenori Watanabe, Satoshi Tanaka, Shinich Matsumoto, Takashi Onose, Hiroyuki Nogawa, Yasufumi Kawasuji, Takashi Matsunaga, Junichi Fujimoto, Hakaru Mizoguchi

Author Affiliations +

Proceedings Volume 7640, Optical Microlithography XXIII; 76402A (2010) https://doi.org/10.1117/12.846337
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

ArF immersion technology is spotlighted as the enabling technology for the 45nm node and beyond. Recently, double exposure technology is also considered as a possible candidate for the 32nm node and beyond. We have already released an injection lock ArF excimer laser, the GT61A (60W/6kHz/10mJ/0.30pm) with ultra line-narrowed spectrum and stabilized spectrum performance for immersion lithography tools with N.A.>1.3, and we have been monitoring the field reliability data of our lasers used in the ArF immersion segment since Q4 2006. In this report we show field reliability data of our GigaTwin series - twin chamber ArF laser products. GigaTwin series have high reliability. The availability that exceeds 99.5% proves the reliability of the GigaTwin series. We have developed tunable and high power injection-lock ArF excimer laser for double patterning, GT62A (Max90W/6000Hz/Tunable power with 10-15mJ/0.30pm (E95)) based on the GigaTwin platform. A number of innovative and unique technologies are implemented on GT62A. - Support the latest illumination optical system - Support E95 stability and adjustability - Reduce total cost (Cost of Consumables, Cost of Downtime and Cost of Energy & Environment)

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Masaya Yoshino, Hiroshi Umeda, Hiroaki Tsushima, Hidenori Watanabe, Satoshi Tanaka, Shinich Matsumoto, Takashi Onose, Hiroyuki Nogawa, Yasufumi Kawasuji, Takashi Matsunaga, Junichi Fujimoto, and Hakaru Mizoguchi "Flexible and reliable high power injection locked laser for double exposure and double patterning ArF immersion lithography", Proc. SPIE 7640, Optical Microlithography XXIII, 76402A (10 March 2010); https://doi.org/10.1117/12.846337

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