Paper
30 March 2010 Thermal sensors based on nano porous silicon
Jia-Chuan Lin, Wei-Chih Tsai, Meng-Kai Hsu, Hsi-Ting Hou, Yi-Hung Chen
Author Affiliations +
Abstract
In this study, the thermal properties of silicon samples with surfaces of porous and geometrical formation were reported. The etching methods of anodization chemical and heated KOH were utilized to perform the studied nano porous silicon (NPS) and pyramidal, respectively. Compared with usual surface formation of ordinary silicon sample, the larger surface to volume ratios were obtained from the fabricated NPS and pyramidal silicon devices. For the thermal applications such as thermal sensor and microheater, the etching profiles and surface to volume ration of studied were clarified by SEM measurement. Furthermore, the differential scanning calorimetry (DSC) was used to evaluate the thermal dissipation properties of studied samples.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jia-Chuan Lin, Wei-Chih Tsai, Meng-Kai Hsu, Hsi-Ting Hou, and Yi-Hung Chen "Thermal sensors based on nano porous silicon", Proc. SPIE 7646, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2010, 76461U (30 March 2010); https://doi.org/10.1117/12.853184
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KEYWORDS
Silicon

Infrared sensors

Etching

Picosecond phenomena

Manufacturing

Calorimetry

Scanning electron microscopy

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