Flexible packaging and integration of CMOS IC with elastomeric microfluidics

Bowei Zhang; Quan Dong; Can E. Korman; Zhenyu Li; Mona E. Zaghloul

doi:10.1117/12.2015554

29 May 2013 Flexible packaging and integration of CMOS IC with elastomeric microfluidics

Bowei Zhang, Quan Dong, Can E. Korman, Zhenyu Li, Mona E. Zaghloul

Proceedings Volume 8730, Flexible Electronics; 873004 (2013) https://doi.org/10.1117/12.2015554
Event: SPIE Defense, Security, and Sensing, 2013, Baltimore, Maryland, United States

Abstract

We have demonstrated flexible packaging and integration of CMOS IC chips with PDMS microfluidics. Microfluidic channels are used to deliver both liquid samples and liquid metals to the CMOS die. The liquid metals are used to realize electrical interconnects to the CMOS chip. As a demonstration we integrated a CMOS magnetic sensor die and matched PDMS microfluidic channels in a flexible package. The packaged system is fully functional under 3cm bending radius. The flexible integration of CMOS ICs with microfluidics enables previously unavailable flexible CMOS electronic systems with fluidic manipulation capabilities, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing.

Citation Download Citation

Bowei Zhang, Quan Dong, Can E. Korman, Zhenyu Li, and Mona E. Zaghloul "Flexible packaging and integration of CMOS IC with elastomeric microfluidics", Proc. SPIE 8730, Flexible Electronics, 873004 (29 May 2013); https://doi.org/10.1117/12.2015554

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