MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias

B. Mukhopadhyay; M. Fritz; P. Mackowiak; T. C. Vu; O. Ehrmann; K.-D. Lang; H.-D. Ngo

doi:10.1117/12.2017159

17 May 2013 MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias

B. Mukhopadhyay, M. Fritz, P. Mackowiak, T. C. Vu, O. Ehrmann, K.-D. Lang, H.-D. Ngo

Author Affiliations +

Proceedings Volume 8763, Smart Sensors, Actuators, and MEMS VI; 87632N (2013) https://doi.org/10.1117/12.2017159
Event: SPIE Microtechnologies, 2013, Grenoble, France

Abstract

Design, simulation, fabrication, and characterization of novel MEMS pressure sensors with new back-side-direct-exposure packaging concept are presented. The sensor design is optimized for harsh environments e.g. space, military, offshore and medical applications. Unbreakable connection between the active side of the Si-sensor and the protecting glass capping was realized by anodic bonding using a thin layer of metal. To avoid signal corruption of the measured pressure caused by an encapsulation system, the media has direct contact to the backside of the Si membrane and can deflect it.

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B. Mukhopadhyay, M. Fritz, P. Mackowiak, T. C. Vu, O. Ehrmann, K.-D. Lang, and H.-D. Ngo "MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias", Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 87632N (17 May 2013); https://doi.org/10.1117/12.2017159

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