Peculiarities of substrate mass loss under micron pulse laser direct structuring

I. Volyansky; I. Shishkovsky

doi:10.1117/12.2038210

6 December 2013 Peculiarities of substrate mass loss under micron pulse laser direct structuring

I. Volyansky, I. Shishkovsky

Proceedings Volume 9065, Fundamentals of Laser-Assisted Micro- and Nanotechnologies 2013; 90650L (2013) https://doi.org/10.1117/12.2038210
Event: Fundamentals of Laser Assisted Micro- and Nanotechnologies 2013, 2013, St. Petersburg, Russian Federation

Abstract

In this paper, we discuss the issues relevant for the laser-machining process, including the precision and the material removal rate. We have investigated a surface morphology and a mass loss of technical rubber and plastic, industrial silicon and stainless steel ribbon after irradiation by microsecond laser pulses at different pulse energies, repetition rate and irradiation strategies. Laser milling with microsecond pulses (~ 10^-5-10^-6 s) is a thermal material removal process usually associated with detrimental effects such as heat affected zones, a recast layer and debris. It was shown, that process optimization can lead to considerable reduction of the above mentioned negative effects. The mass removal rates are analyzed depending on environment conditions and laser influence regimes. At the optimum operation parameters, have demonstrated that the experimental mass lost is significantly different from the theoretical estimations and this demands a future model improvement.

Citation Download Citation

I. Volyansky and I. Shishkovsky "Peculiarities of substrate mass loss under micron pulse laser direct structuring", Proc. SPIE 9065, Fundamentals of Laser-Assisted Micro- and Nanotechnologies 2013, 90650L (6 December 2013); https://doi.org/10.1117/12.2038210

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